PCB专业术语中英文翻译
很多PCB的书上使用的是英文，但是大多数的人又看不懂英文，这时候怎么办呢，我们需要翻译，但是如果每看到一个不会的词儿就去翻译，那么就太耗费时间了，所以我们捷多邦总结了一些常用的专业术语的中英文对照，希望能对大家有用。
1.印制电路：printed circuit
2.印制线路：printed wiring
3.印制板：printed board
4.印制板电路：printed circuit board (pcb)
5.印制线路板：printed wiring board(pwb)
6.印制元件：printed component
7.印制接点：printed contact
8.印制板装配：printed board assembly
9.板：board 1
10.表面层合电路板：surface laminar circuit (slc)
11.埋入凸块连印制板：b2it printed board
12.多层膜基板：multi-layered film substrate(mfs)
13.层间全内导通多层印制板：alivh multilayer printed board
14.载芯片板：chip on board (cob)
15.埋电阻板：buried resistance board
16.母板：mother board
17.单面印制板：single-sided printed board(ssb)
18.双面印制板：double-sided printed board(dsb)
19.多层印制板：mulitlayer printed board(mlb)
20.多层印制电路板：mulitlayer printed circuit board
21.多层印制线路板：mulitlayer prited wiring board
22.刚性印制板：rigid printed board
23.刚性单面印制板：rigid single-sided printed borad
24.刚性双面印制板：rigid double-sided printed borad
25.刚性多层印制板：rigid multilayer printed board
26.子板：daughter board
27.背板：backplane
28.裸板：bare board
29.键盘板夹心板：copper-invar-copper board
30.动态挠性板：dynamic flex board
31.静态挠性板：static flex board
32.可断拼板：break-away planel
33.电缆：cable
34.挠性扁平电缆：flexible flat cable (ffc)
35.薄膜开关：membrane switch
36.混合电路：hybrid circuit
37.厚膜：thick film
38.厚膜电路：thick film circuit
39.薄膜：thin film
40.挠性多层印制板：flexible multilayer printed board
41.挠性印制板：flexible printed board
42.挠性单面印制板：flexible single-sided printed board
43.挠性双面印制板：flexible double-sided printed board
44.挠性印制电路：flexible printed circuit (fpc)
45.挠性印制线路：flexible printed wiring
46.刚性印制板：flex-rigid printed board, rigid-flex printed board
47.刚性双面印制板：flex-rigid double-sided printed board,
rigid-flex double-sided printed
48.刚性多层印制板：flex-rigid multilayer printed board, rigid-
flex multilayer printed board
49.齐平印制板：flush printed board
50.金属芯印制板：metal core printed board
51.金属基印制板：metal base printed board
52.多重布线印制板：mulit-wiring printed board
53.陶瓷印制板：ceramic substrate printed board
54.导电胶印制板：electroconductive paste printed board
55.模塑电路板：molded circuit board
56.模压印制板：stamped printed wiring board
57.顺序层压多层印制板：sequentially-laminated mulitlayer
58.散线印制板：discrete wiring board
59.微线印制板：micro wire board
60.积层印制板：buile-up printed board
61.积层多层印制板：build-up mulitlayer printed board (bum)
62.积层挠印制板：build-up flexible pr
上面是一些比较常见的专业用语，有一些不是特别常用的有时候我们也会遇到，所以我们捷多邦也总结了一些不怎么常用的中英文对照，希望对你来说是有用的：
1.Absorption 吸收、吸入
2.Accelerated Test（Aging）加速试验、加速老化
3.Accelerator 加速剂、速化剂
4.Accept/Acceptance 允收
5.Acceptable Quality Level（AQL）允收品质水准
6.Accuracy 准确度ACF：
7.Adhesive copper foil 有胶铜箔
8.Activator 活化剂、添加剂比称为
9.Activator Active parts（Devices）主动零件，指积体电路或电
晶体
10.Addition Agent 添加剂
11.Additive Process 加成法、分全加成、半加成及部份加成
12.Back Light（Back Lighting）背光法
13.Back-UP 垫板
14.Backpanels/ Backplanes 背板、支持板，厚度较厚，
15.Ball Grid Array（BGA）球脚车列（封装）
16.Barrel 孔壁
17.Base Material 基材
18.Batch 批（同时间发料某一数量的板子）
19.Bevelling 切斜边
20.Binder 黏结剂
21.Capacitance 电容
22.Carbide 碳化物、碳化钨钻头
23.CAR: Corrective Action Report 改善报告
24.Carbon Treatment 活性碳处理
25.Card 卡板
26.Carrier 载体
27.Cartridge 滤芯
28.Cathode 阴极
L: Copper Clad Laminates 铜箔基板
30.Ceramics 陶瓷
31.Certificate 证明书
32.CFC 氟氯碳化物
33.Chloro-Fluoro-Carbon Chamfer 倒角、去掉直角
34.Characteristic Impedance 特性阻抗
35.Cheek list 检察清单
36.Chip 晶粒、晶片
37.Chip On Board 晶片黏著板
38.Clean Room 无尘室(Class 100)
39.Cleanliness 清洁度
40.Clearance 余隙、余环
41.COB（Chip on Board）晶片在板上直接组装
42.COC（Certificate of Compliance）出货合格书。