Bonding Process
The Wire Bond
Temp
PREHEAT
BONDSITE
CU L/F200+/-10
200+/-10
AL L/F210+/-10
230+/-10
BGA 150+/-10
160+/-10
TFBGA150+/-10
160+/-10
LBGA 150+/-10
160+/-10
= 17 – 90 mm @ bonding area in Y = 54mm L = 280 mm [Maximum] T = 0.075 – 0.8 mm
•Applicable Magazine W = 100 mm (Maximum) L = 140 – 300 mm H = 180 mm (Maximum)
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Search Speed 2
Search Tol 2
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Search Speed 2
Search Tol 2
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Formation of a second bond
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heat
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Formation of a second bond Contact
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SEARCH SPEED1
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SEARCH TOL 1
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Free air ball is captured in the chamfer
SEARCH SPEED1
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SEARCH TOL 1
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Free air ball is captured in the chamfer
SEARCH SPEED1 SEARCH TOL 1
Capillary Data ( Tip , Hole , CD , FA&OR , IC )
CAPILLARY (II)
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Formation of a first bond
SEARCH SPEED1 SEARCH TOL 1
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Formation of a first bond
IMPACT FORCE
SEARCH SPEED1 SEARCH TOL 1
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Formation of a first bond Contact
• Tool less conversion window clamps and top plate enables fast device
Eagle
MACHINE SPECIFICATIONS (I) •Bonding System •Bonding Method Thermosonic (TS) •BQM Mode Constant Current, Voltage, Power and Normal
WIRE BOND PROCESS INTRODUCTION
CONTENTS
ASSEMBLY FLOW OF PLASTIC IC Wire Bond 原理 M/C Introduction Wire Bond Process Material SPEC Calculator DEFECT
X Y Table
•Linear 3 phase AC Servo motor •High power AC Current Amplifier •DSP based control platform •High X-Y positioning accuracy of +/- 1 mm •Resolution of 0.2 mm
•Magazine Pitch 2.4 – 10 mm (0.09” – 0.39 “) •Device Changeover < 4 minutes •Package Changeover < 5 minutes •Number of Buffer Magazine 3 (max. 435 mm)
NOT INCLUDE DEDICATE LINE
Free air ball is captured in the chamfer
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Free air ball is captured in the chamfer
SEARCH HEIGHT
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Free air ball is captured in the chamfer
封裝簡介
晶片Die
金線 Gold Wire 導線架
Lead fram
Wafer Grinding
封裝流程
Wafer Saw
Die Bonding
toaster
Wire Bonding
Die Surface Coating
Molding
Laser Mark
BGA
SURFACE MOUNTPKG THROUGH HOLE PKG
Calculated Wire Length
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Calculated Wire Length
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SEARCH DELAY
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TRAJECTORY
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TRAJECTห้องสมุดไป่ตู้RY
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TRAJECTORY
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TRAJECTORY
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Formation of a new free air ball
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Material
Leadfram Capillary Gold Wire
Leadfram (I)
Leadfram ( II )
CAPILLARY (I)
Capillary Manufacturer (SPT, GAISER, PECO, TOTO…)
Programmable profile, control and vibration modes
Eagle
MACHINE SPECIFICATIONS (II)
•Vision System •Pattern Recognition Time 70 ms / point •Pattern Recognition Accuracy + 0.37 um •Lead Locator Detection 12 ms / lead
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Formation of a second bond Base
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Tail
length
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Disconnection of the tail
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Disconnection of the tail
W/H ASSY
• changeover
•·Fully programmable indexer & tracks
•·Motorized window clamp with soft close feature
•·Output indexer with leadframe jam protection feature
TRAJECTORY
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TRAJECTORY
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TRAJECTORY
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TRAJECTORY
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TRAJECTORY
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TRAJECTORY
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2nd Search Height
Search Speed 2
Search Tol 2
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Capillary rises to loop height position
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Capillary rises to loop height position
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Capillary rises to loop height position
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Capillary rises to loop height position
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Free air ball is captured in the chamfer
SEARCH SPEED1 SEARCH TOL 1
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Free air ball is captured in the chamfer
SEARCH SPEED1 SEARCH TOL 1
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Eagle
MACHINE SPECIFICATIONS (III)
•Material Handling System •Indexing Speed 200 – 250 ms @ 0.5 “ pitch •Indexer Resolution 1um •Leadframe Position Accuracy + 2 mil •Applicable Leadframe W = 17 – 75 mm @ bonding area in Y = 65mm
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Capillary rises to loop height position
RH
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