WIRE BOND PROCESS INTRODUCTION
1
CONTENTS
ASSEMBLY FLOW OF PLASTIC IC
Wire Bond 原理
M/C Introduction
Wire Bond Process
Material
SPEC
Calculator
DEFECT
2
封裝簡介
(3 leads/frame) •Lead Locator Accuracy + 2.4 um •Post Bond Inspection First Bond, Second Bond
Wire Tracing •Max. Die Level Different 400 – 500 um
•Facilities •Voltage 110 VAC (optional 100/120/200/210/ •220/230/240 VAC
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W/H ASSY
• changeover •·Fully programmable indexer & tracks •·Motorized window clamp with soft close feature •·Output indexer with leadframe jam protection feature • Tool less conversion window clamps and top plate enables fast device
Programmable profile, control and vibration modes
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Eagle
MACHINE SPECIFICATIONS (II) •Vision System •Pattern Recognition Time 70 ms / point •Pattern Recognition Accuracy + 0.37 um •Lead Locator Detection 12 ms / lead
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X Y Table
•Linear 3 phase AC Servo motor •High power AC Current Amplifier •DSP based control platform •High X-Y positioning accuracy of +/- 1 mm •Resolution of 0.2 mm
Gold wire
pad lead
5
B.PRINCIPLE
PRESSURE VIBRATION
AL2O3
CONTAMINATION GLASS
GOLD BALL
Al SiO2SiMOITURE6銲接條件
HARD WELDING
Pressure (Force)
Amplify & Frequecy
12
Eagle
MACHINE SPECIFICATIONS (III)
•Material Handling System •Indexing Speed 200 – 250 ms @ 0.5 “ pitch •Indexer Resolution 1um •Leadframe Position Accuracy + 2 mil •Applicable Leadframe W = 17 – 75 mm @ bonding area in Y = 65mm
= 17 – 90 mm @ bonding area in Y = 54mm L = 280 mm [Maximum] T = 0.075 – 0.8 mm
10
Eagle
MACHINE SPECIFICATIONS (I) •Bonding System •Bonding Method Thermosonic (TS) •BQM Mode Constant Current, Voltage, Power and Normal
(Programmable) •Loop Type Normal, Low, Square & J •XY Resolution 0.2 um •Z Resolution (capillary travelling motion)2.5 um •Fine Pitch Capability 35 mm pitch @ 0.6 mil wire •No. of Bonding Wires up to 1000 •Program Storage 1000 programs on Hard Disk •Multimode Transducer System
Welding Time (Bond Time)
Welding Tempature (Heater)
THERMAL BONING
Thermal Compressure
Ultrasonic Energy (Power)
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Bond Head ASSY
• Low impact force •Real time Bonding Force monitoring • High resolution z-axis position with 2.5 micron per step resolution • Fast contact detection • Suppressed Force vibration • Fast Force response • Fast response voice coil wire clamp
晶片Die
金線 Gold Wire 導線架
Lead fram
3
Wafer Grinding
封裝流程
Wafer Saw
Die Bonding
toaster
Wire Bonding
Die Surface Coating
Molding
Laser Mark
BGA
SURFACE MOUNTPKG THROUGH HOLE PKG
Solder Ball Placement
Dejunk TRIM Solder Plating
Singulation
Solder Plating TRIM/ FORMING
Dejunk TRIM
Packing 4
Wire Bond 原理
Ball Bond ( 1st Bond )
Wedge Bond ( 2nd Bond )