until it reaches room temperature.
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競華電子(深圳)有限公司
• D、曝光
A+PCB Electorics(Shen Zhen)Co.,LTD
a、负片黄菲林；
Negative Yellow Film
b、注意丝印孔对位的准确性。 NhomakorabeaPay attention to the registration accuracy of
thickness according to lot card.
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競華電子(深圳)有限公司
A+PCB Electorics(Shen Zhen)Co.,LTD
• 2.2一次冲/ 钻孔One-time Hole-punching/drilling A、一次冲/ 钻孔主要冲管位孔和工艺孔，孔位和孔徑均
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競華電子(深圳)有限公司
• B 贴膜Film
A+PCB Electorics(Shen Zhen)Co.,LTD
a、干膜种类： ****
film type: ***
b 、预烘和贴膜时间间隔要尽量短。
The interval between pre-cure and film- pasting time
要符合图纸要求； One-time hole-punching/drilling is mainly to punchorientation-hole and technical hole. The holeposition and hole-diameter must be consistent with drawing requirement. B、冲/钻板方向为从铜面到铝面，可有效避免铝面擦花； Punching/drilling direction is from Cu surface to Al surface,which can effectively avoid scratches of Al surface.
競華電子(深圳)有限公司
A+PCB Electorics(Shen Zhen)Co.,LTD
鋁基板制作流程介紹
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競華電子(深圳)有限公司
A+PCB Electorics(Shen Zhen)Co.,LTD
一、鋁基板制程
• 1、噴錫流程：
來料檢查→ 一次沖/ 鑽孔→圖形轉移→圖形 檢查→蝕刻→退膜→蝕檢→阻焊制作→ 打定 位孔→字符制作→噴錫→噴錫檢查→單面磨 板（依客戶要求而定）→ V-CUT/成型→通斷 測試→高壓測試→FQC、FQA→包裝入庫
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競華電子(深圳)有限公司
• 2.3、图形转移Image Transfer A+PCB Electorics(Shen Zhen)Co.,LTD A、磨板Scrubbing a、为提高干膜和保护膜面的结合力，防止保护膜面干 膜、脱落，可轻磨保护膜面； In order to improve the combination of dry film & protective film and to avoid falling off dry film on the protective film, it is necessary to lightly scrub the surface of protective film. b 、不允许有板面氧化和胶渍现象。 Oxidation and left glue stains on the board surface cannot be allowed.
silkscreening hole.
• E 、静置Placing
线路部分发生光聚反应, 经15min左右充分聚合。
The light-gathering reaction happens at the circuit part
and reaches full aggregation after 15 minutes.
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競華電子(深圳)有限公司
A+PCB Electorics(Shen Zhen)Co.,LTD
• 2 、OSP 流程
来料检查→一次冲/钻孔→图形转移→图 形检查→蚀刻→退膜→蚀检→→阻焊制作 →打定位孔→字符制作→V-CUT/成型→ 测试→FQC、FQA→OSP→FQC→包装入库
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競華電子(深圳)有限公司
二、制程制作事项
A+PCB Electorics(Shen Zhen)Co.,LTD
• 2.1来料检查IQC
A、铜面检查：不允许有凹坑、擦花和严重氧化痕迹；
Cu surface check: Notches, scratches and serious
oxidation are not allowed.
should be as short as possible
• C、静置冷却Placing and Cooling
.為了對位的准确，需將已貼膜的鋁基板靜置冷卻至室
溫。
In order to assure accurate registration, it is necessary
to place aluminous board with pasted film for a while
• F 、显影Developing
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競華電子(深圳)有限公司
A+PCB Electorics(Shen Zhen)Co.,LTD
• 2.4 圖形檢查Image Check A 、檢查重點在于開路、短路、缺口、顯影不淨等； Mainly check open circuit, short circuit, gap and unclean developing etc. B 、修板時不能用黑油筆，只能用黑油補； Black oil-pen cannot be used when mending board but black oil.
B、保护膜检查：保护膜不应有破损至铝面露出；
Protective film check: Protective film mustn’t be
broken withCu exposure.
C、厚度检查：按流程卡要求检测板厚、铜厚。
Thickness check: Check board thickness and Cu