品質系統常見英文簡介1.QC : quality control 品質管制2. IQC : incoming quality control 進料品質管制3. OQC : output quality control 出貨品質管制4. PQC : process quality control 製程品質管制也稱IPQC : in process quality control .5. AQL : acceptable quality level 允收標準6. CQA: customer quality assurance 客戶品質保証7. MA : major defeat 主要缺點8. MI : minor defeat 次要缺點9. CR :critical defeat 關鍵缺點10. SMT : surface mounting technology 表面粘貼技術11. SMD : surface mounting device SMC : surface mounting component 表面粘貼元件12 . ECN : engineering change notice 工程變更通知13 . DCN : design change notice 設計變更通知14 . PCB : printed circuit board 印刷電路板15 . PCBA : printed circuit board assembly裝配印刷電路板16 . BOM : bill of material 材料清單17. BIOS : basically input and output system 基本輸入輸出系統18. MIL-STD-105E : 美國陸軍標準,也稱單次抽樣計劃.19 . ISO : international standard organization 國際標準化組織20 . DRAM: 內存條21 . Polarity : 電性22 . Icicles : 錫尖23 . Non-wetting : 空焊24 . Short circuit : 短路25 . Missing component : 缺件26 . Wrong component : 錯件27 . Excess component : 多件28 . Insufficient solder : 錫少29 . Excessive solder : 錫多30 . Solder residue : 錫渣31 . Solder ball : 錫球32 . Tombstone : 墓碑33 . Sideward : 側立34 . Component damage : 零件破損35 . Gold finger : 金手指36 . SOP : standard operation process 標準操作流程37 . SIP : standard inspection process 標準檢驗流程38 . The good and not good segregation :良品和不良品區分39 . OBW : on board writer 熸錄BIOS 40 . Simple random sampling : 簡單隨機抽樣41 . Histogram : 直方圖42 . Standard deviation : 標準差43 . CIP : Continuous improvement program44 . SPC : Statistical process control45 . Sub-contractors : 分包商46 . SQE : Supplier quality engineering47 . Sampling sample :抽樣計劃48 . Loader : 治具49 . QTS: Quality tracking system 品質追查系統50 . Debug : 調試51 . Spare parts :備用品52 . Inventory report for : 庫存表53 . Manpower/Tact estimation 工時預算54 . Calibration : 校驗55 . S/N :serial number 序號56 . Corrugated pad : 波紋墊57 .Takeout tray : 內包裝盒58 . Outerbox : 外包裝箱59 . Vericode : 檢驗碼60 . Sum of square : 平方和61 . Range : 全距62 . Conductive bag : 保護袋63 . Preventive maintenance :預防性維護64 . Base unit : 基體65 . Fixture : 制具66 . Probe : 探針67 . Host probe : 主探針68 . Golden card : 樣本卡69 . Diagnostics program : 診斷程序70 . Frame : 屏面71 . Lint-free gloves : 靜電手套72 .Wrist wrap : 靜電手環73 . Target value : 目標值74. Related department : 相關部門75. lifted solder 浮焊76.plug hole孔塞77. Wrong direction 极性反ponent damage or broken 零件破損79.Unmeleted solder熔錫不良80.flux residue松香未拭81.wrong label or upside down label貼反82.mixed parts機種混裝83. poor solder mask綠漆不良84. oxidize 零件氧化85.stand off height浮高86. IC reverse IC反向87.supervisor課長88. Forman組長89. WI=work instruction作業指導90. B.P.V:非擦除狀態91. Internal notification:內部聯絡單92. QP :Quality policy品質政策93.QT: Quality target 品質目標94. Trend:推移圖95.Pareto:柏拉圖96. UCL: Upper control limit管制上限97.LCL:Lower control limit管制下限98. CL: Center line中心線99.R.T.Y: Rolled throughout yield直通率100. PPM: Parts per million 不良率101.DPU: Defects per unit 單位不良率102.Resistor: 電阻103.Capacitor:電容104. Resistor array : 排阻105. Capacitor array: 排容106. DIODE: 二極管107.SOT: 三極管108. Crystal:震盪器109. Fuse:保險絲110.Bead: 電感111.Connector:聯結器112.ADM: Administration Department行政單位113. CE: Component Engineering零件工程114. CSD :Customer Service Department客戶服務部115. ID: Industrial Design工業設計116.IE: Industrial Engineering工業工程117. IR: Industrial Relationship工業關係118. ME: Mechanical Engineering機構工程119. MIS :Management Information System資訊部120. MM: Material Management資材121. PCC: Project Coordination/Control專案協調控制122. PD: Production Department生產部123. PE: Product Engineering產品工程124. PM: Product Manager產品經理125. PMC: Production Material Control生產物料管理126. PSC: Project Support & Control產品協調127.Magnesium Alloy:鎂合金128. Metal Shearing:裁剪129.CEM: Contract Electronics Manufacturing 又稱電子製造服務企業EMS: Electronics Manufacturing Services130. ERP: Enterprise Resource Planning 企業資源規劃SCM+CRM+ERP+EAI=Network direct TM links procurement ,production ,Logistics and sales採購,生產,后勤管理及市場行銷的融合EAI: Enterprise application Intergration 企業應用系統整合CRM: Customer Relationship Planning 客戶服務規劃SCM : Supply chain management 供應鏈管理131. OJT: On job training 在職培訓132.Access Time: 光碟搜尋時間133. B2CEC:Business to consumer electronic commerce 企業對消費者的電子商務B2BEC:Business to business electronic Commerce 企業間的電子商務L:Copper Clad Laminate 銅箔基板135. Intranet: 企業內部通訊網路136. ISP: Internet Service Provider網絡服務提供者ICP: Internet Content Provider網絡內容提供者137. GSM: Global System for Mobile Communication 泛歐數位式行動電話系統GPS: 全球衛星定位系統138. Home Page: 網路首頁39.Video Clip:影像檔140.HTML:超文標記語言141.Domainname: 網域名稱142.IP: 網絡網域通訊協定地址143.Notebook:筆記型電腦144.VR:Virtual Reality虛擬實境145.WAP:Wireless Application Protocol 無線應用軟體協定146. LAN : Local area network區域網路WWW: World Wide Web世域網路WAN: Wide Area Network 廣域網路147.3C: Computer, Communication , Consumer electronic 電腦, 通訊, 消費性電子三大產品的整合rmation Supplier Highway:信息高速公路149.UPS:Uninterrupted power system不斷電系統150.Processed material: 流程性材料151.Entity/Item:實體152.Quality loop:質量環153.Quality losses: 質量損失154.Corrective action:糾正措施155. Preventive action:預防措施156.PDCA:Plan/Do/Check/Action計劃/實施/檢查/處理157. Integrated circuits(IC):集成電路158.Application program:應用程序159.Utilities:實用程序160.Auxiliary storage/Second storage:;輔助存儲器161.Silicon chip:硅片162Diskette drive:軟驅163.Display screen/Monitor:顯示器164.Foreground:前面165.Montherboard:母板166.Mermory board:內存板167.Slot:插槽168.Bus:Data-bus/address-bus/Control bus:總線/數據總線/地址總線/控制總線169.Plotter:繪圖170.MPC:Multimedia personal computer多媒體171.Oscillator:振盪器172.Automatic teller terminal:自動終端(出納)機173.Joystick port:控制端口174.VGA: Video Graphics Array 顯示卡175.Resolution:分辨率176.Register:寄存器177.ISA: Industry Standard Architecture:工業標準結構178.EISA:Extended Industry Architecture 179.Adapter: 适配器180.Peripheral:外部設備181.Faxmodem:調制解調器181.NIC:Network interface card網絡接口卡182.SCSI:Small computer system interface 183.VESA:Video Electronic Standards Association184.SIMM:Single in-line memory module單排座存儲器模塊(內存條)185.Casing:外箱186.Aluminum:鋁質187.Ceramic: 陶瓷的188.Platter:圓盤片189.Actuator:調節器190.Spindle:軸心191.Actuation arm: 存取臂192.Default code: 缺省代碼193.Auxiliary port:輔助端口194. Carriage return : 回車195.Linefeed:換行196.ASCII:American Standard Code for Information Interchange197.Video analog: 視頻模擬198.TTL:Transistor- Transistor logic晶體管-晶體管邏輯電路199.Three-prong plug:三芯電插頭200.Female connector:連接插座201.Floppy disk:軟盤202.Output level:輸出電平203.Vertical/Horizontal synchronization:場/行同步204.H(Horizontal)-Phase:行相位patible:兼容機206.Hardware Expansion Card: 硬件擴充卡207.Buffer:緩沖208.CRM:Customer relationship Management 客戶關係管理209.WIP: Work in process半成品210.Waiver:特別採用211.CXO系列—CEO: Chief Executive Office首COO :Chief Operating Office CFO: Chief Finance Officer CBO: Chief Business Officer CTO: Chief Technology Officer CIO: Chief Information Officer CGO: Chief Government Officer212.NASDAQ: 納斯達克證券市場NASDAQ Automated Quotation system 213.VC:Venture Capital 風險投資214.PDA:Personal Date Assistant個人數字助理PLA: Personal Information Assistant個人信息助理215.PPAP:Advanced Product Quality Planning and Control Plan 生產性零組件核准程序216.FMEA:Protentical Failure Mode and Effects Analysis失效模式與效應分析217.MSA: Measurement Systems Analysis 量測系統分析218.QAS:Quality System Assessment 品質系統評鑑219.Cusum: 累計總合圖220.Overall Equipment Effectiveness設備移動率221.Benchmarking:競爭標竿Analysis of motion/Ergonomics 動作分析/人體工程學222.Roka Yoke 防錯法MCR: machine capability ratio 機器利用率223.Mistake Proofing 防呆法Taguchi methods田口式方法224,Vertical integration垂直整合Surveillance定期追蹤審查225.EMS: Electronics Manufacturing Supply-chain 226.Cause&Effects charts 特性要因圖227.Scattle: 散佈圖Fool-Proof System防呆系統228.VE:Value Engineering 價值工程QFP:Quality Function Development 品質機能展開229.Arrow Chart 箭頭圖法Affiliate Chart親和圖法230.PDPC:Process Decision Program Chart System Chart系統圖法231.Relation Chart 關邊圖法Matrix Chart矩陣圖法232.Matrix Data Analysis矩陣數據分析法234.Brain-storm 腦風暴法JIT: Just In Time:及時性生產模擬235.Deming Prize: 戴明獎Prototype技術試作236 BPM:Business Process Management .業務流程管理MBO:目標管理237. MBP:方針管理FTA:故障樹分析QSCV: 服務品質238.IPPB:Information 情況Planning策劃Programming規劃Budget預算239.EQ:Emotion Quotient:情商IQ: Intelligence Quotient:智商240.Implied Needs:隱含要求Specified Requirement:規定要求241.Probation:觀察期IncomingProduct released for urgent production 緊急放行242.Advanced quality planning 先進的質量策劃243. AOQ: Average Outgoing Quality 平均檢出質量AOQL: Average Outgoing Quality Limit 平均檢出質量界限244.Approved Supplier List 經核准認可的供應商名單245.Attribute date 特征Benchmarking 基準點Calibration 校準246.Capable process工序能力Capability Index 工序能力指數Capability ratio 工序能力率247.CHANGE CYCLE TIME 修改的時間周期Continuous improvement 持續改進Control plans 控制策劃Cost of quality 質量成本Cycle time reduction 減少周期時間Design of experiments 實驗設計Deviation / Substitution 偏差/ 置換ESD: Electrostatic discharge 靜電釋放EH&S: Environmental, Health, and Safely 環境,健康.安全248.ESS: Environmental Stress Screening 環境應力篩選FMEA: Failure Mode Effect Analysis 失誤模式效應分析First Article approval 產品的首次論證First pass yield 一次性通過的成品率249.First sample inspection 第一次樣品檢驗FMECA: Failure mode effect and critically analysis 失誤模式,效應及後果分析Gauge control 測量儀器控制GR&R: Gauge repeatability and reproducibility 測量儀器重復性和再現性HALT: Highly Accelerated Life Test 高加速壽命試驗HAST: Highly Accelerated Stress Test 高加速應力試驗IN-CONTROL PROCESS 受控制工序INDUSTRIAL AVERAGE 工業平均數250.JIT (just in time) manufacturing (即時)制程Key characteristic 關健特征Key component 關健構件251.Life Testing 壽命試驗Lot traceability 批量可追溯性252.Material review board 原材料審查部門MCR: machine capability ratio 機械能力率253.NONCONFORMANCE 不符合OUT-OF-CONTROL PROCESS 失控工序Pilot Application 試產(試用) 254.PPM: Parts per million 百万分之一Preventive vs detection 預防與探測Preventive maintenance 預防維護Process capability index 工序能力指數Process control 工序控制Process improvement 工序改進Process simplification 過程簡化Quality Clinic Process Chart (QCPC) 質量診斷過程圖255.Quality information system 質量資料體系Quality manual 質量手冊Quality plan 質量計劃Quality planning 質量策劃Quality policy 質量方針Quality system 質量體系256.Reliability 可靠性RUN Chart 趨勢表Skill Matrix 技能表Statistical quality control (SQC) 統計質量控制Teamwork 團隊工作Total quality management 全面質量管理Variable data 變量數據Variation 影響變量Value Analysis 價值分析Visual Factory 形象化工厂Survey Instructions 調查指引257.Profile 概況Improvement Plan 改進計劃Evaluation 評估Implementation 實施Compliance 符合Supplier Audit Report 供方審核報告Site Audit 現場審核Typical agenda 典型的議事日程Internal and external failure costs 內部和外部的失誤成本Failure rate percentage 失誤百分率258.Productivity (output / input) 生產率(產出/投入)Customer complaints 客戶投訴Customer satisfaction indices 客戶滿意度指數Root cause analysis of failures 失誤根原分析259.SFCS:Shop floor control system Nominal:名目的Enumeration: 列舉Screening stage: 篩選階段Screening materials:屏蔽材料Nonparametric comparative experimental:非參數實驗Pitfall:缺陷Fractional factorialexperiments:部份隨機實驗Management by communication:溝通管理技術Management by objective:目標管理技術Management by result:績效管理技術Human relationship skill:人際技術Conceptial skill:理念性技術Safety stock:安全庫存lead time:訂購前置時間EOQ: Economic order Quantity 經濟訂購量Run at rate:節拍生產260.Early production containment : 早期生產管制程序Accreditation Body:認可機構Active part在用零件261.Aftermarket part售后零件Analysis of Motion/Ergonomics:運動/人機工程學分析Finite Element analysis:有限元分析Geometric Dimensioning & Tolerancing:幾何尺寸與公差Match check匹配檢查Last off part comparison:末件比較Simulation Techniques:倣真技術Solid Modeling:實體造型Layout Inspection:全尺寸檢驗Service Parts:維修零件Remote location:外部場所Overall Equipment effectiveness:設備總效率PPAP: production part approval process生產件批准程序Bulk material:散裝材料Perishable Tools:易損工裝Growth Projections:企業營運成長企劃Projected Sales figures:行銷企劃藍圖Human resource development:人力資源開發Feasibility Reviews:可行性審查Pre-launch:量產前Unscheduled machine downtime:非計劃排定的停機時間Excessive cycle time:作業周期時間過多Non value-added use of floor space:工廠內的無附加價值事項New Target values to Optimized customer process:將顧客作業程序管理到最好的新目標值Misshipments:耽誤出貨Incomplete orders:交貨不足Inventory turns over time:存貨周轉時間Stock rotation :存貨周轉Inventory levels:最低庫存量Order-drive:訂單導向Interim action:臨時措Permanent action:永久措施Integrators:組合體。