封裝型式
Shape
Typical Features
Materia Lead Pitch No of I/O l
Cerami c
1.27, 0.762 mm
(50, 30miles) 2, 4 direction
lead
20~80
Ceramic
1.27,1.016, 0.762 mm (50, 40, 30
(氧化处理)
Depositio n
(沉积)
WireBondin g
(焊线)
Laser mark (激光印字)
Laser Cut & package saw
(切割成型)
Testin g
(测试)
Lithograp hy
(微影)
Wafer Inspection (晶圆检查) 前段結束
Moldin g
(塑封)
Plastic
1.27 mm (50miles) 2 direction
lead
8 ~40
Plastic
1.0, 0.8, 0.65 mm 4 direction
lead
88~200
Surface Mount
FPG
Flat Package of Glass
LCC
Leadless Chip
Carrier
lead
18~124
Ceramic 0.5 mm
32~200
SMT (Optional)
Taping (Optional)
Assembly Main Process
Grinding (Optional)
Detaping (Optional)
Wafer Mount
UV Cure (Optional)
HITACHI ESEC ASM C-SUN K&S SKW ASM MARCH TEPLA TOWA ASA
MODEL
DB700 ESEC2007/2008
ASM889898 QDM-4S
K&S MAXUM ULTRA UTC-2000 Eagle60 AP1000 TEPLA400
半导体封装制程与设备材料知识简介
半导体封装制程概述
半导体前段晶圆wafer制程 半导体后段封装测试
封装前段（B/G-MOLD）－封装后段（MARK-PLANT）－测试
封装就是將前製程加工完成後所提供晶圓中之每一顆IC晶粒獨立分離，並外 接信號線至導線架上分离而予以包覆包装测试直至IC成品。
半导体制程
Package (包装)
製造完成
封 裝 型 式 (PACKAGE)
Through Hole
Mount
DIP
Dual In-line Package
Shape
Typical Features
Materia Lead Pitch No of I/O l
Ceramic Plastic
2.54 mm (100miles)
Die Saw Molding
Die Bond
Die Cure (Optional)
Plasma
Post Mold Cure
Laser mark
Laser Cut
Wire Bond
Package Saw
Cleaner
Memory Test
Card Asy
Card Test
Packing for Outgoing
Skinny Dual In-line
Package
PBGA
Pin Grid Array
Shape
封裝型式
Typical Features
Materia l
Ceramic Plastic
Lead Pitch
2.54 mm (100miles)
half-size pitch in the
width direction
8 ~64
SIP
Single In-line Package
Plastic
2.54 mm (100miles) 1 direction
lead
3~25
Through Hole
Mount
ZIP
Zigzag In-line Package
S-DIP
Shrink Dual In-line
Package
封裝型式
IC制造开始
Wafer Cutting (晶圆切断)
Etchin g
(蚀刻) 后段封装开始
Wafer Reduce (晶圆减薄)
Diffusion Ion Implantation (扩散离子植入)
Grind & Dicing (晶圓研磨及切割)
Die Attach (上片)
Oxidizatio n
TSK
MODEL
HOR-2I HS-60 DR3000-III PG300RM 8560 MA3000 MA3000 DFD 6361 A-WD-300T
半导体设备供应商介绍-前道部分
PROCESS
DIE BOND
CURE OVEN WIRE BONDER
PLASMA CLEAN Mold
VENDOR
miles)
20~40
封裝型式
Surface Mount
PLCC
Plastic Leaded Chip Carrier
VSQF
Very Small Quad Flatpack
Shape
Typical Features
of I/O
1.27 mm (50miles) j-shape bend 4 direction
Shape
Typical Features
Materia Lead Pitch No of I/O l
Plastic
2.54 mm (100miles) 1 direction
lead
16~24
Plastic
1.778 mm (70miles)
20 ~64
Through Hole
Mount
SK-DIP
半导体设备供应商介绍-前道部分
PROCESS
SMT - PRINTER SMT – CHIP MOUNT
TAPING INLINE GRINDER & POLISH
STANDALONE GRINDER DETAPING
WAFER MOUNTER DICING SAW
VENDOR
DEK SIMENS NITTO ACCRETECH DISCO NITTO NITTO DISCO
No of I/O 24~32
Ceramic Plastic
2.54 mm (100miles)
封裝型式
Surface Mount
SOP Small Outline Package
QFP Quad-Flat
Pack
Shape
Typical Features
Materia Lead Pitch No of I/O l